| Wednesday 9 April 2008 | ||
| 13.00 - 13.50 | Buffet Lunch | |
| 13.50 | Opening by L. Jacob, Conference Chairman (Chairman TC) | |
| 14.00 - 17.30 | SESSION 1 | |
| Session Chairman: P. Broschk, tesa AG | ||
| 14.10 - 14.35 |
Electrically Conductive Acrylic Pressure Sensitive Adhesives | |
| 14.35 - 15.00 |
Recent Developments in Halogenfree Flame Retardant Pressure Sensitive Hot Melt Adhesives (HMPSA) | |
| 15.00 - 15.25 | Continuous Production of Solvent Based Adhesives L. Gallino - F.lli MARIS S.p.A. (I) | |
| 15.25 - 16.00 | Break | |
| 16.00 - 16.25 | Debonding Mechanisms in Pressure Sensitive Adhesive Joints P.L. Geiss - University of Kaiserslautern (G) (co-authors V. Kohl, M. Presser, A. Wagner) | |
| 16.25 - 16.50 | Choosing the Right Foam for Sealing Tape Applications L. Berger - Sekisui Alveo AG (CH) | |
| 16.50 - 17.15 | Advances in printable UV Pressure Sensitive Adhesives F. Küster - 3M Deutschland GmbH (G) | |
| 17.15 - 17.50 | Panel Discussion | |
| 19.00 | Welcome Cocktail | |
| 20.00 | Free Evening | |
| Thursday 10 April 2008 | ||
| 09.00 - 12.30 | SESSION 2 | |
| Session Chairman: R. Pfaff, tesa AG | ||
| 09.00 | Opening | |
| 09.05 - 09.30 |
Foaming of Hotmelt Adhesives | |
| 09.30 - 09.55 |
Novel Acrylic PSA with Outstanding Low Energy Surface Adhesion | |
| 09.55 - 10.20 |
Emission Requirements - Impact on Adhesives and Self-Adhesive Products | |
| 10.20 - 11.00 | Break | |
| 11.00 - 11.25 |
Expanding the Limits - New HMPSA for Tape Applications | |
| 11.25 - 11.50 |
Strategies to Enhance Adhesion on Polyolefin Surfaces | |
| 11.50 - 12.30 | Panel Discussion | |
| 12.30 | Lunch | |
| 14.00 - 17.30 | SESSION 3 | |
| Session Chairman: Ch. Donker, Eastman Chemical Middelburg B.V. | ||
| 14.00 - 14.25 |
Wet-Out: The Red Herring of Adhesion Science | |
| 14.25 - 14.50 | VOC's and Solvent-Related Air Quality Issues D. Arns - Secretary General ESIG (B) | |
| 14.50 - 15.15 | State-of-Art Technology for Colouring Adhesive Masses V. Magnolfi - Icap-Sira Chemicals and Polymers S.p.A. (I) | |
| 15.15 - 16.00 | Break | |
| 16.00 - 16.25 | REACH: Consequences for Tape Making P.W. Verspoor - Sitmae Consultancy BV (NL) | |
| 16.25 - 16.50 | Innovations in Water Based Acrylic Technology W. Griffith (co-author S. Sundaram) - Rohm and Haas (U.S.A.) | |
| 16.50 - 17.30 | Panel Discussion | |
| 18.00 - 19.00 | Cocktails in the Hotel | |
| 19.30 | Conference Dinner in the 'Museumbrasserie' | |
| Friday 11 April 2008 | ||
| 09.00 - 12.45 | SESSION 4 | |
| Session Chairman: to be determined | ||
| 09.00 | Opening | |
| 09.05 - 09.30 |
Wire Harness Tapes for a non Halogen Automotive Future | |
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| 09.30 - 09.55 |
Increasing Efficiency when using Energy of UV Curing Systems | |
| 09.55 - 10.20 |
New Acrylic and SB Pressure Sensitive Adhesives | |
| 10.20 - 11.00 | Break | |
| 11.00 - 11.25 |
Medical Devices and Pharmaceutical Products Coated with Pressure Sensitive Adhesives | |
| 11.25 - 11.50 | Legislations - Driving Force for New Additive Developments M. Roessing (co-author K. Lehmann) - Evonik Goldschmidt GmbH (G) | |
| 11.50 - 12.15 |
Stabilization of Hot-Melt-Adhesives - Selection of Appropriate Stabilization Systems | |
| 12.15 - 13.05 | Panel Discussion | |
| 13.05 - 13.15 | Closure by L. Jacob, Conference Chairman (Chairman TC) | |
| 13.15 | Closure Lunch |
